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| Feature | HDI | |
| Standard | Advance | |
| Layer Count | 24 Layers | 32layers |
| HDI | 1 Step-3 Steps | 4 Steps & Anylayer |
| Max PCB Delivery Size | 300*450 | 400*500 |
| Raw Material | FR-4 TG170 | Rogers 4350, 370HR |
| Outer Based Cu | 1 oz | 2 oz |
| Inner Based Cu | 1 oz | 2 oz |
| Aspect Ratio(PTH) | 12:01 | 1:15 |
| Aspect Ratio(Laser) | 1:01 | 0.8:1 |
| Surface Treatment | HASL-LF, ENIG, ENPIG, OSP, GOLD FINGER, IMMERSION TIN, IMMERSION SILVER | |
| Laser Hole Size | 0.2mm | 0.15mm |
| Min Line/Spacing Out | 3 mils | 2 mils |
| Min Line/Spacing Inner | 3 mils | 2 mils |
| Min Solder Mask Bridge | 5 mils | 3 mils |
| Half Holes | 20 mils | 8 mils |
| Feature | IMS Project (Alu Based PCB) | |
| Standard | Advance | |
| Layer Count | 4 Layers | 6 layers |
| Max PCB Delivery Size | 400mm*500mm | 1000mm*500mm |
| Thermal Conductivity | 4kw | 5kw |
| Board Thickness | 5 mm | 6 mm |
| Outer Based Cu | 3 oz | 4 oz |
| Inner Based Cu | 1 oz | 2 oz |
| Aspect Ratio | 10:01 | 12:01 |
| Surface Treatment | OSP/ENIG | |
| Min Hole Sizes | 1.0 mm | 0.8 mm |
| Feature | High Frequency PCB | |
| Standard | ||
| Layer Count | 8 Layers (FR-4+Rogers) | 12layers (Rogers) |
| Max PCB Delivery Size | 300*450 | 400*500 |
| Tg | 280 | |
| Board Thickness | 1.6mm | |
| Outer Based Cu | 1 oz | 2 oz |
| Inner Based Cu | 1 oz | 2 oz |
| Aspect Ratio | 12:01 | 15:01 |
| Surface Treatment | HASL-LF, ENIG, ENPIG, OSP, GOLD FINGER, IMMERSION TIN, IMMERSION SILVER | |
| Drill Hole Size | 0.2mm | |
| Min Line/Spacing Out | 3 mils | 2 mils |
| Min Line/Spacing Inner | 3 mils | 2 mils |
| Min Solder Mask Bridge | 5 mils | 3 mil |
| Half Holes | 20 mils | 8 mils |
| Feature | Standard RIGID PCB | |
| Standard | Advance | |
| Layer Count | 24 Layers | 40 layers |
| Max PCB Delivery Size | 950mm*600mm | 1200mm*600mm |
| TG | TG135, TG150, TG170, TG180 | |
| Board Thickness | 5.0mm | 6.0mm |
| Outer Based Cu | 8 oz | 10 oz |
| Inner Based Cu | 6 oz | 8 oz |
| Aspect Ratio | 1:12 | 1:15 |
| Surface Treatment | HASL-LF, ENIG, ENPIG, OSP, GOLD FINGER, IMMERSION TIN, IMMERSION SILVER | |
| Hole Size | 0.15 mm | 0.1 mm |
| Min Line/Spacing Out | 3 mils | 2 mils |
| Min Line/Spacing Inner | 3 mils | 2 mils |
| Min BGA Pitch | 12 mils | 8 mils |
| Impedance | 10% | 7% |
| Min Solder Mask Bridge | 5 mils | 3 mils |
| Half Holes | 20 mils | 8 mils |
| Back Drill | 3 Times | 6 Times |
